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Today's Date: 27th September 2021  <<< BUA homepage   contact us>>>

Cross sectional, non-destructive

Ersascope Inspection system 3000

The revolutionary ERSASCOPE inspection System 3000 offers a cross sectional, non-descructive visual image of hidden solder joints by looking under the BGA.

At a fraction of the cost of an xray system the ERSASCOPE is a bench-top, user-friendly, safe and cost effective method for quality inspecting all types of BGA, microBGA and flip-chip components, in addition to many other applications e.g. interior fillets of PQFP and PLCC components, where a microscope or X-ray fails.

ERSASCOPE can aid in problem solving such as Excess Flux, incomplete melt of solder paste, cracking zones and other potential failure points such as cold solder joints.

Click here for picture of ERSASCOPE machine.

Below shows imaging system inspecting solder joints:

Contact us now for more information or to have a representative form BUA contact you.

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